Ceramic, glass, crystal and other brittle materials research equipment - the intermediate series includes the outer circle cutting machine, diamond wire cutting machine, and the newly developed GPC-100A precision grinding and polishing control instrument, which can accurately grasp the preparation accuracy. At the same time, equipped with UNIPOL-1202 automatic precision grinding and polishing machine and SKZD-2, SKZD-3 hopper to achieve unattended grinding and polishing, abrasive materials, polishing agent, the right amount of automatic addition, effectively saving manpower, time, raw materials And greatly improved work efficiency. In addition, the full set of equipment costs only 100,000 yuan.
1
Cutting
STX-202A small diamond wire cutting machine
SYJ-400 CNC dicing cutting machine
2
Heat bonding
MTI-250 heating platform
3
Grinding control
GPC-100A precision grinding and polishing controller
4
Abrasive addition
SKZD-2 drip feeder
SKZD-3 drip feeder
5
Grinding
UNIPOL-1202 automatic precision grinding and polishing machine
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The MTI-250 heating platform is used to melt paraffin to bond the sample to the sample tray.
SYJ-400 CNC dicing cutter for various crystals, ceramics, glass, ore,
Scribing and cutting of materials such as metals.
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UNIPOL-1202 automatic precision grinding and polishing machine for crystal, ceramic, metal, glass, rock sample, mine
Grinding and polishing of samples and other materials.
GPC-100A precision grinding and polishing controller can accurately control the amount of de-layering of sample grinding and polishing.
The sample was fixed by vacuum adsorption.
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The SKZD-2 Dripper enables automatic control of abrasive dripping during grinding.
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Tri-ply Stainless Steel Frypan
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